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      6 Layers Module PCB Design PCB layout-PCB Manufacturer Shenzhen Grande

      Time:2018-05-16 16:56:55 Click:

      Shenzhen Grande Electronic offers 6 Layers Corn Module PCB layout / ARM Processor / 18-year experienced layout team


       

       

       

       

       

       

       

       

       

       

       

       

      Supplier: Shenzhen Grande Electronic
      Layers: 6
      Application: 6 Layers Module PCB Design PCB layout-PCB Manufacturer Shenzhen Grande

      Software: PADS
      Features: Matched length for data, address and clock’s traces, used different groups and layers
      Design time: 5 Days


       

        

      【Description】


       PCB layout Features:
      1, Matched length for data, address and clock traces.
      2, Used different groups and layers

      PCB Fabrication:
      Layers: 6
      Surface Treatment: Im Au
      Material: FR-4/HTg170, 1.6mm, 1oz finished Copper
      Impedance Control Tolerance: +/-10%
      Others: 5/5mil,Via:8mil


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