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    6 Layers Module PCB Design PCB layout-PCB Manufacturer Shenzhen Grande

    Time:2018-05-16 16:56:55 Click:

    Shenzhen Grande Electronic offers 6 Layers Corn Module PCB layout / ARM Processor / 18-year experienced layout team


     

     

     

     

     

     

     

     

     

     

     

     

    Supplier: Shenzhen Grande Electronic
    Layers: 6
    Application: 6 Layers Module PCB Design PCB layout-PCB Manufacturer Shenzhen Grande

    Software: PADS
    Features: Matched length for data, address and clock’s traces, used different groups and layers
    Design time: 5 Days


     

      

    【Description】


     PCB layout Features:
    1, Matched length for data, address and clock traces.
    2, Used different groups and layers

    PCB Fabrication:
    Layers: 6
    Surface Treatment: Im Au
    Material: FR-4/HTg170, 1.6mm, 1oz finished Copper
    Impedance Control Tolerance: +/-10%
    Others: 5/5mil,Via:8mil


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