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How To Take Electrostatic Prevention Measures During PCB Assembly?

2020-12-22

During PCB Assembly, processing personnel will strictly follow the bill of materials, PCB silk screen and outsourcing processing requirements to insert or mount components, but electronic components often generate more or less static electricity without p

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Analysis Of Solder Beads Defects In SMT Assembly

2020-12-19

SMT Assembly solder beads defects not only affect the appearance but also cause bridging defects. Simply speaking, solder beads can be divided into two categories: One type appears on one side of the SMD component, often in the shape of an independent lar

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Brief Introduction Of PCBA Manufacturing Process

2020-12-18

There are various stages in PCBA manufacturing process, including printing solder paste on the circuit board, component placement, soldering, inspection and testing. All these processes are necessary and need to be monitored to ensure that the highest qua

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How To Replace SMD Components For SMT Assembly Board?

2020-12-17

It is well known that SMD component is one of the materials that have more contact in SMT Repair. That’s to say, in SMT Assembly, SMD components often need to be replaced from time to time. It seems very simple to replace SMD components, but there are sti

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How To Control the Quality of SMT Assembly Reflow Soldering?

2020-12-16

must be soldered to the circuit board through the SMT Assembly reflow soldering process. The advantage of this process is that the temperature is easier to control, oxidation can be avoided during welding, and the cost of manufacturing products is easier

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The Influence Of Gold On Solder Joints In SMT Assembly

2020-12-15

In SMT Assembly, gold has become one of the most commonly used surface coating metals due to its excellent stability and reliability. But as an impurity in the solder, gold is very harmful to the ductility of the solder, because the brittle Sn-Au (tin-gol

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Choosing HASL or HAL In PCB Assembly?

2020-12-14

At present, there are two kinds of lead processing technology in PCBA, which can be selected according to customer requirements, including HASL and HAL processing technology. However, there are plenty of customers who don’t really understand the differenc

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The Influence Of Board Thickness & Copper Thickness On PCB Design

2020-12-11

The board thickness and copper thickness are mainly considered for the production of circuit boards. The standard series of boards with a thickness of more than 0.8MM are: 1.0 1.2 1.6 2.0 3.2 MM, while the thickness of the board is not considered as a sta

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PCB Design & Layout Skills

2020-12-10

The following items need to be considered when conveying the Schematic to PCB layout. All the examples mentioned below were developed under Multisim design environment, but the same concepts apply when using various EDA tools.

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Causes & Solutions Of Insufficient BGA Solder Joints In PCBA

2020-12-09

When it comes to PCBA BGA rework, underfilled solder joints refer to insufficient volume of solder joints. BGA solder joints cannot be reliably connected in BGA soldering. The characteristic of underfilled solder joints is that the appearance of the solde

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