With hundreds of industrial IoT devices collecting and sharing data together, factories have become more complex. Combined with software automation, PCBA manufacturers are also using IoT-based networks to optimize their operations, find new efficiencies a
As we all know, MID and VR devices are one of electronic devices. Except for useful work, most of the electrical energy consumed during work is converted into heat and emitted. The heat generated by the electronic equipment causes the internal temperature
The spacing between SMD components is an issue that engineers must pay attention to when designing PCB. Because if the pitch is too small, then it will be quite difficult to print solder paste and avoid solder joints.
The recommended distance is a
The shielding cover actually is an alloy metal cover, which is a vital component to reduce display radiation. It can effectively reduce the mutual interference between modules when used in MID or VR products. As shown in Figure 1, it is common in the main
Different processes, such as reflow soldering and wave soldering, have different component layouts. When double-sided reflow soldering, there are different requirements for the layout of the A side and the B side; Selective wave soldering and traditional
Regarding the similarities and differences of the coating materials for land, sea and air equipment, plenty of literature can be searched online. In short, I believe that moisture resistance is the most basic performance requirement of various three-proof
1. The wetting of PCBA pad and component welding surface does not meet the processing requirements;
2. The use of solder paste does not meet the processing standards;
3. The thermal expansion coefficients of welding and various electric materials are no
The solder paste is added to the component pad, after the solder paste printing of the bare PCB is completed, the relevant electronic components are mounted through reflow soldering, and then reflow soldering is performed.
The poor solderability of the circuit board holes will result in PCB Assembly and welding defects, which will affect the parameters of the components in the circuit, leading to unstable conduction between the components of the multilayer board and the inn