High-speed placement machine: A device that accurately places tiny surface-mount (SMD) components on a PCB pad by moving the mounting head. It is mainly composed of rack, PCB transmission and bearing organization, drive system, positioning and alignment s
Since multilayer PCBs are commonly used in high speed and high performance systems where a couple of layers are used for power or ground reference planes, which are typically undivided solid planes that will act as current return paths for signal traces a
Main material composition of FPC: Substrate & Coverlay (similar to solder mask ). And the substrate is mainly composed of PI / PET + adhensive + copper.
Obviously, artificial intelligence is quite attractive to users and developers. As far as I am concerned, the following two aspects are the major considerations:
PCB Main Function: The provider of electrical connection of electronic components, it plays the role of relay transmission and the key electronic interconnection of electronic products, and which is also known as the "mother of electronic products&am
VLSI design means the IC (integrated circuit internal interconnect) design, which is the physical implementation of the circuit inside the chip;
PCB design refers to the circuit board design, and the design object is the macro circuit, that’s to say, u
Since the embedded system adopts a microprocessor to implement a relatively single function and a separate operating system, a large number of peripheral devices are often not required. Therefore, in terms of volume and power consumption, embedded system
Rosin. As you probably know, flux is usually a mixture that rosin is as the main component, which is an auxiliary material to ensure the smooth progress of the welding process and whose main component is C20H3002.
Copper. No matter which kind of PCB substrate, they are virtually coated with copper on the substrate.
While gold and silver are only used for surface treatment as well as silver paste plug hole.